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FO D ED ME N S OM RE C SI G N NOT NEW DE 2027 L1 Data E IS SE Sheet
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X1227
May 8, 2006 FN8099.2
2-WireTM RTC Real TimeClock/Calendar/ CPU Supervisor with EEPROM
FEATURES
* Real Time Clock/Calendar -- Tracks Time in Hours, Minutes, and Seconds -- Day of the Week, Day, Month, and Year * 2 Polled Alarms (Non-volatile) -- Settable on the Second, Minute, Hour, Day of the Week, Day, or Month -- Repeat Mode (periodic interrupts) * Oscillator Compensation on Chip -- Internal Feedback Resistor and Compensation Capacitors -- 64 Position Digitally Controlled Trim Capacitor -- 6 Digital Frequency Adjustment Settings to 30ppm * CPU Supervisor Functions -- Power-On Reset, Low Voltage Sense -- Watchdog Timer (SW Selectable: 0.25s, 0.75s, 1.75s, off) * Battery Switch or Super Cap Input * 512 x 8 Bits of EEPROM -- 64-Byte Page Write Mode -- 8 Modes of Block LockTM Protection -- Single Byte Write Capability * High Reliability -- Data Retention: 100 Years -- Endurance: 100,000 Cycles Per Byte * 2-WireTM Interface Interoperable with I2C* -- 400kHz Data Transfer Rate * Low Power CMOS -- 1.25A Operating Current (Typical) * Small Package Options -- 8 Ld SOIC and 8 Ld TSSOP * Repetitive Alarms * Temperature Compensation * Pb-Free Plus Anneal Available (RoHS Compliant)
APPLICATIONS * * * * * * * * * * * * * * * Utility Meters HVAC Equipment Audio/Video Components Set Top Box/Television Modems Network Routers, Hubs, Switches, Bridges Cellular Infrastructure Equipment Fixed Broadband Wireless Equipment Pagers/PDA POS Equipment Test Meters/Fixtures Office Automation (Copiers, Fax) Home Appliances Computer Products Other Industrial/Medical/Automotive
DESCRIPTION The X1227 device is a Real Time Clock with clock/calendar, two polled alarms with integrated 512x8 EEPROM, oscillator compensation, CPU Supervisor (POR/LVS and WDT) and battery backup switch. The oscillator uses an external, low-cost 32.768kHz crystal. All compensation and trim components are integrated on the chip. This eliminates several external discrete components and a trim capacitor, saving board area and component cost.
BLOCK DIAGRAM
OSC Compensation
X1 X2 Frequency Divider 1Hz Timer Calendar Logic Time Keeping Registers (SRAM) Battery Switch Circuitry VCC VBACK
32.768kHz
Oscillator
SCL SDA
8
RESET
Watchdog Timer Low Voltage Reset
Mask
Serial Interface Decoder
Control Decode Logic
Control/ Registers (EEPROM)
Status Registers (SRAM)
Alarm
Compare Alarm Regs (EEPROM) 4K EEPROM ARRAY
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved *I2C is a Trademark of Philips. All other trademarks mentioned are the property of their respective owners.
X1227
ORDERING INFORMATION
PART NUMBER X1227S8-4.5A X1227S8Z-4.5A (Note 1) X1227S8I-4.5A X1227S8IZ-4.5A (Note 1) X1227V8-4.5A X1227V8Z-4.5A (Note 1) X1227V8I-4.5A X1227V8IZ-4.5A (Note 1) X1227S8* X1227S8Z* (Note 1) X1227S8I X1227S8IZ (Note 1) X1227V8 X1227V8Z (Note 1) X1227V8I X1227V8IZ (Note 1) X1227S8-2.7A X1227S8Z-2.7A (Note 1) X1227S8I-2.7A* X1227S8IZ-2.7A* (Note 1) X1227V8-2.7A X1227V8Z-2.7A (Note 1) X1227V8I-2.7A X1227V8IZ-2.7A (Note 1) X1227S8-2.7* X1227S8Z-2.7 (Note 1) X1227S8I-2.7* X1227S8IZ-2.7 (Note 1) X1227V8-2.7 X1227V8Z-2.7 (Note 1) X1227V8I-2.7 X1227V8IZ-2.7 (Note 1) PART MARKING X1227AL X1227ZAL X1227AM X1227ZAM 1227AL 1227ALZ 1227AM 1227AMZ X1227 X1227Z X1227I X1227ZI 1227 1227Z 1227I 1227IZ X1227AN X1227ZAN X1227AP X1227ZAP 1227AN 1227ANZ 1227AP 1227APZ X1227F X1227ZF X1227G X1227ZG 1227F 1227FZ 1227G 1227GZ 2.65V 100mV 2.7 to 5.5 2.85V 100mV 4.38V 112mV VCC RANGE (V) 4.5 to 5.5 VTRIP 4.63V 112mV TEMPERATURE RANGE (C) 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 -40 to 85 PACKAGE 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld SOIC 8 Ld SOIC (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) 8 Ld TSSOP 8 Ld TSSOP (Pb-free) PKG. DWG. # MDP0027 MDP0027 MDP0027 MDP0027 M8.173 M8.173 M8.173 M8.173 MDP0027 MDP0027 MDP0027 MDP0027 M8.173 M8.173 M8.173 M8.173 MDP0027 MDP0027 MDP0027 MDP0027 M8.173 M8.173 M8.173 M8.173 MDP0027 MDP0027 MDP0027 MDP0027 M8.173 M8.173 M8.173 M8.173
*Add "T1" suffix for tape and reel. NOTES: 1. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. For appropriate volume, any VTRIP value from 2.6 to 4.7V may be ordered via Intersil's Customer Specification Program (CSPEC).
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PIN DESCRIPTIONS
X1227 8 LD SOIC X1 X2 RESET VSS 1 2 3 4 8 7 6 5 VCC VBACK SCL SDA X1227 8 LD TSSOP VBACK VCC X1 X2 1 2 3 4 8 7 6 5 SCL SDA VSS RESET
NC = No internal connection
PIN ASSIGNMENTS Pin Number SOIC
1 2 3
TSSOP
3 4 5
Symbol
X1 X2 RESET
Brief Description
X1. The X1 pin is the input of an inverting amplifier and should be connected to one pin of a 32.768kHz quartz crystal. X2. The X2 pin is the output of an inverting amplifier and should be connected to one pin of a 32.768kHz quartz crystal.. Reset Output - RESET. This is a reset signal output. This signal notifies a host processor that the watchdog time period has expired or that the voltage has dropped below a fixed VTRIP threshold. It is an open drain active LOW output. VSS. Serial Data (SDA). SDA is a bidirectional pin used to transfer data into and out of the device. It has an open drain output and may be wire ORed with other open drain or open collector outputs. Serial Clock (SCL). The SCL input is used to clock all data into and out of the device. The input buffer on this pin is always active (not gated). VBACK. This input provides a backup supply voltage to the device. VBACK supplies power to the device in the event the VCC supply fails. This pin can be connected to a battery, a Supercap or tied to ground if not used. VCC.
4 5
6 7
VSS SDA
6 7
8 1
SCL VBACK
8
2
VCC
3
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ABSOLUTE MAXIMUM RATINGS Temperature Under Bias ................... -65C to +135C Storage Temperature ........................ -65C to +150C Voltage on VCC, VBACK pin (respect to ground)...............................-0.5V to 7.0V Voltage on SCL, SDA, X1 and X2 pin (respect to ground) ............... -0.5V to 7.0V or 0.5V above VCC or VBACK (whichever is higher) DC Output Current .............................................. 5 mA Lead Temperature (Soldering, 10 sec) .............. 300C Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC OPERATING CHARACTERISTICS (Temperature = -40C to +85C, unless otherwise stated.) Symbol
VCC VBACK VCB VBC
Parameter
Main Power Supply Backup Power Supply Switch to Backup Supply Switch to Main Supply
Conditions
Min
2.7 1.8 VBACK -0.2 VBACK
Typ
Max
5.5 5.5 VBACK -0.1 VBACK +0.2
Unit
V V V V
Notes
OPERATING CHARACTERISTICS Symbol
ICC1 ICC2 ICC3 IBACK
Parameter
Read Active Supply Current Program Supply Current (nonvolatile) Main Timekeeping Current Timekeeping Current - (Low Voltage Sense and Watchdog Timer disabled Input Leakage Current Output Leakage Current Input LOW Voltage Input HIGH Voltage Schmitt Trigger Input Hysteresis Output LOW Voltage for SDA and RESET
Conditions
VCC = 2.7V VCC = 5.0V VCC = 2.7V VCC = 5.0V VCC = 2.7V VCC = 5.0V VBACK = 1.8V VBACK = 3.3V
Min
Typ
Max
400 800 2.5 3.0 10 20
Unit
A A mA mA A A A A
Notes
1, 5, 7, 14 2, 5, 7, 14 3, 7, 8, 14, 15 3, 6, 9, 14, 15
"See Performance Data"
1.25 1.5 10 10 -0.5 VCC x 0.7 or VBACK x 0.7 VCC x 0.2 or VBACK x 0.2 VCC + 0.5 or VBACK + 0.5
ILI ILO VIL VIH VHYS VOL1
A A V V V
10 10 13 13 13 11
VCC related level VCC = 2.7V VCC = 5.5V
.05 x VCC or .05 x VBACK 0.4 0.4
V
Notes: (1) The device enters the Active state after any start, and remains active: for 9 clock cycles if the Device Select Bits in the Slave Address Byte are incorrect or until 200nS after a stop ending a read or write operation. (2) The device enters the Program state 200nS after a stop ending a write operation and continues for tWC. (3) The device goes into the Timekeeping state 200nS after any stop, except those that initiate a nonvolatile write cycle; tWC after a stop that initiates a nonvolatile write cycle; or 9 clock cycles after any start that is not followed by the correct Device Select Bits in the Slave Address Byte. (4) For reference only and not tested. (5) VIL = VCC x 0.1, VIH = VCC x 0.9, fSCL = 400KHz (6) VCC = 0V (7) VBACK = 0V (8) VSDA = VSCL=VCC, Others = GND or VCC
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(9) VSDA =VSCL=VBACK, Others = GND or VBACK (10)VSDA = GND or VCC, VSCL = GND or VCC, VRESET = GND or VCC (11)IOL = 3.0mA at 5.5V, 1.5mA at 2.7V (12) IOH = -1.0mA at 5.5V, -0.4mA at 2.7V (13)Threshold voltages based on the higher of Vcc or Vback. (14)Using recommended crystal and oscillator network applied to X1 and X2 (25C). (15)Typical values are for TA = 25C
Capacitance TA = 25C, f = 1.0 MHz, VCC = 5V Symbol
COUT CIN
(1) (1)
Parameter
Output Capacitance (SDA, RESET) Input Capacitance (SCL)
Max.
10 10
Units
pF pF
Test Conditions
VOUT = 0V VIN = 0V
Notes: (1) This parameter is not 100% tested. (2) The input capacitance between x1 and x2 pins can be varied between 5pF and 19.75pF by using analog trimming registers
AC CHARACTERISTICS AC Test Conditions
Input Pulse Levels Input Rise and Fall Times Input and Output Timing Levels Output Load VCC x 0.1 to VCC x 0.9 10ns VCC x 0.5 Standard Output Load
Figure 1. Standard Output Load for testing the device with VCC = 5.0V Equivalent AC Output Load Circuit for VCC = 5V
5.0V For VOL= 0.4V and IOL = 3 mA
1533 SDA 100pF
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AC Specifications (TA = -40C to +85C, VCC = +2.7V to +5.5V, unless otherwise specified.) Symbol
fSCL tIN tAA tBUF tLOW tHIGH tSU:STA tHD:STA tSU:DAT tHD:DAT tSU:STO tDH tR tF Cb SCL Clock Frequency Pulse width Suppression Time at inputs SCL LOW to SDA Data Out Valid Time the bus must be free before a new transmission can start Clock LOW Time Clock HIGH Time Start Condition Setup Time Start Condition Hold Time Data In Setup Time Data In Hold Time Stop Condition Setup Time Data Output Hold Time SDA and SCL Rise Time SDA and SCL Fall Time Capacitive load for each bus line 20 20 50(1) 0.1 1.3 1.3 0.6 0.6 0.6 100 0 0.6 50 +.1Cb(2) +.1Cb(2) 300 300 400 0.9
Parameter
Min.
Max.
400
Units
kHz ns s s s s s s ns s s ns ns ns pF
Notes: (1) This parameter is not 100% tested. (2) Cb = total capacitance of one bus line in pF.
TIMING DIAGRAMS Bus Timing
tF SCL tSU:STA SDA IN tHD:STA tSU:DAT tHD:DAT tSU:STO tHIGH tLOW tR
tAA SDA OUT
tDH
tBUF
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Write Cycle Timing
SCL
SDA
8th Bit of Last Byte
ACK tWC Stop Condition Start Condition
Power-up Timing Symbol
tPUR
(1) (1)
Parameter
Time from Power-up to Read Time from Power-up to Write
Min.
Typ.(2)
Max.
1 5
Units
ms ms
tPUW
Notes: (1) Delays are measured from the time VCC is stable until the specified operation can be initiated. These parameters are periodically sampled and not 100% tested. (2) Typical values are for TA = 25C and VCC = 5.0V
Nonvolatile Write Cycle Timing Symbol
tWC
(1)
Parameter
Write Cycle Time
Min.
Typ.(1)
5
Max.
10
Units
ms
Notes: (1) tWC is the time from a valid stop condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle. It is the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.
WATCHDOG TIMER/LOW VOLTAGE RESET OPERATING CHARACTERISTICS Watchdog/Low Voltage Reset Parameters Symbols
VPTRIP
Parameters
Programmed Reset Trip Voltage X1227-4.5A X1227 X1227-2.7A X1227-2.7 VCC Detect to RESET LOW Power-up Reset Time-out Delay VCC Fall Time VCC Rise Time Watchdog Timer Period: WD1 = 0, WD0 = 0 WD1 = 0, WD0 = 1 WD1 = 1, WD0 = 0 Watchdog Reset Time-out Delay 2-Wire interface Reset Valid VCC
Min.
4.5 4.25 2.7 2.55 100 10 10 1.7 725 225 225 1 1.0
Typ.
4.68 4.38 2.93 2.68 200
Max.
4.75 4.5 3.0 2.7 500 400
Unit
V
tRPD tPURST tF tR tWDO
ns ms s s
1.75 750 250 250
1.8 775 275 275
s ms ms ms s V
tRST tRSP VRVALID
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VTRIP Programming Timing Diagram
VCC (VTRIP) VTRIP tTSU tTHD
RESET VCC
VP = 15V tVPS 01234567 01234567 01234567 tVPH 01234567 tRP tVPO
VCC
SCL
SDA AEh 00h 03h/01h 00h
VTRIP Programming Parameters Parameter
tVPS tVPH tTSU tTHD tVPO tRP VP VTRAN Vtv
Description
VTRIP Program Enable Voltage Setup time VTRIP Program Enable Voltage Hold time VTRIP Setup time VTRIP Hold (stable) time VTRIP Program Enable Voltage Off time (Between successive adjustments) VTRIP Program Recovery Period (Between successive adjustments) Programming Voltage VTRIP Programmed Voltage Range VTRIP Program variation after programming (Programmed at 25C)
Min.
1 1 1 10 0 10 14 1.7 -25
Max.
Units
s s s ms s ms
16 5.0 +25
V V mV
VTRIP programming parameters are not 100% Tested.
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DESCRIPTION (continued) The Real-Time Clock keeps track of time with separate registers for Hours, Minutes, Seconds. The Calendar has separate registers for Date, Month, Year and Day-of-week. The calendar is correct through 2099, with automatic leap year correction. The powerful Dual Alarms can be set to any Clock/Calendar value for a match. For instance, every minute, every Tuesday, or 5:23 AM on March 21. The alarms can be polled in the Status Register. There is a repeat mode for the alarms allowing a periodic interrupt. The X1227 device integrates CPU Supervisor functions and a Battery Switch. There is a Power-On Reset (RESET output) with typically 250 ms delay from power-on. It will also assert RESET when Vcc goes below the specified threshold. The Vtrip threshold is user repro-grammable. There is a WatchDog Timer (WDT) with 3 selectable time-out periods (0.25s, 0.75s, 1.75s) and a disabled setting. The watchdog activates the RESET pin when it expires. The device offers a backup power input pin. This VBACK pin allows the device to be backed up by battery or SuperCap. The entire X1227 device is fully operational from 2.7 to 5.5 volts and the clock/calendar portion of the X1227 device remains fully operational down to 1.8 volts (Standby Mode). The X1227 device provides 4K bits of EEPROM with 8 modes of BlockLockTM control. The BlockLock allows a safe, secure memory for critical user and configuration data, while allowing a large user storage area. PIN DESCRIPTIONS
X1227 8 LD SOIC X1 X2 RESET VSS 1 2 3 4 8 7 6 5 VCC VBACK SCL SDA
Serial Clock (SCL) The SCL input is used to clock all data into and out of the device. The input buffer on this pin is always active (not gated). Serial Data (SDA) SDA is a bidirectional pin used to transfer data into and out of the device. It has an open drain output and may be wire ORed with other open drain or open collector outputs. The input buffer is always active (not gated). An open drain output requires the use of a pull-up resistor. The output circuitry controls the fall time of the output signal with the use of a slope controlled pull-down. The circuit is designed for 400kHz 2-wire interface speeds. VBACK This input provides a backup supply voltage to the device. VBACK supplies power to the device in the event the VCC supply fails. This pin can be connected to a battery, a Supercap or tied to ground if not used. RESET Output - RESET This is a reset signal output. This signal notifies a host processor that the watchdog time period has expired or that the voltage has dropped below a fixed VTRIP threshold. It is an open drain active LOW output. Recommended value for the pullup resistor is 5k. If unused, tie to ground. X1, X2 The X1 and X2 pins are the input and output, respectively, of an inverting amplifier. An external 32.768kHz quartz crystal is used with the X1227 to supply a timebase for the real time clock. The recommended crystal is a Citizen CFS206-32.768KDZF. Internal compensation circuitry is included to form a complete oscillator circuit. Care should be taken in the placement of the crystal and the layout of the circuit. Plenty of ground plane around the device and short traces to X1 and X2 are highly recommended. See Application section for more recommendations. Figure 2. Recommended Crystal connection
SCL SDA VSS RESET X1 X2
X1227 8 LD TSSOP VBACK VCC X1 X2 NC = No internal connection 1 2 3 4 8 7 6 5
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POWER CONTROL OPERATION The power control circuit accepts a VCC and a VBACK input. The power control circuit powers the device from VBACK when VCC < VBACK - 0.2V. It will switch back to power the device from VCC when VCC exceeds VBACK. Figure 3. Power Control
VCC
Voltage
the stop bit is written. The RTC continues to update the time while an RTC register write is in progress and the RTC continues to run during any nonvolatile write sequences. A single byte may be written to the RTC without affecting the other bytes. Accuracy of the Real Time Clock The accuracy of the Real Time Clock depends on the frequency of the quartz crystal that is used as the time base for the RTC. Since the resonant frequency of a crystal is temperature dependent, the RTC performance will also be dependent upon temperature. The frequency deviation of the crystal is a fuction of the turnover temperature of the crystal from the crystal's nominal frequency. For example, a >20ppm frequency deviation translates into an accuracy of >1 minute per month. These parameters are available from the crystal manufacturer. Intersil's RTC family provides on-chip crystal compensation networks to adjust loadcapacitance to tune oscillator frequency from +116 ppm to -37 ppm when using a 12.5 pF load crystal. For more detail information see the Application section. CLOCK/CONTROL REGISTERS (CCR) The Control/Clock Registers are located in an area separate from the EEPROM array and are only accessible following a slave byte of "1101111x" and reads or writes to addresses [0000h:003Fh]. The clock/control memory map has memory addresses from 0000h to 003Fh. The defined addresses are described in the Table 1. Writing to and reading from the undefined addresses are not recommended. CCR access The contents of the CCR can be modified by performing a byte or a page write operation directly to any address in the CCR. Prior to writing to the CCR (except the status register), however, the WEL and RWEL bits must be set using a two step process (See section "Writing to the Clock/Control Registers.") The CCR is divided into 5 sections. These are: 1. 2. 3. 4. 5. Alarm 0 (8 bytes; non-volatile) Alarm 1 (8 bytes; non-volatile) Control (4 bytes; non-volatile) Real Time Clock (8 bytes; volatile) Status (1 byte; volatile)
VBACK
Off
On In
REAL TIME CLOCK OPERATION The Real Time Clock (RTC) uses an external 32.768kHz quartz crystal to maintain an accurate internal representation of the second, minute, hour, day, date, month, and year. The RTC has leap-year correction. The clock also corrects for months having fewer than 31 days and has a bit that controls 24 hour or AM/PM format. When the X1227 powers up after the loss of both VCC and VBACK, the clock will not operate until at least one byte is written to the clock register. Reading the Real Time Clock The RTC is read by initiating a Read command and specifying the address corresponding to the register of the Real Time Clock. The RTC Registers can then be read in a Sequential Read Mode. Since the clock runs continuously and a read takes a finite amount of time, there is the possibility that the clock could change during the course of a read operation. In this device, the time is latched by the read command (falling edge of the clock on the ACK bit prior to RTC data output) into a separate latch to avoid time changes during the read operation. The clock continues to run. Alarms occurring during a read are unaffected by the read operation. Writing to the Real Time Clock The time and date may be set by writing to the RTC registers. To avoid changing the current time by an uncompleted write operation, the current time value is loaded into a separate buffer at the falling edge of the clock on the ACK bit before the RTC data input bytes, the clock continues to run. The new serial input data replaces the values in the buffer. This new RTC value is loaded back into the RTC Register by a stop bit at the end of a valid write sequence. An invalid write operation aborts the time update procedure and the contents of the buffer are discarded. After a valid write operation the RTC will reflect the newly loaded data beginning with the next "one second" clock cycle after
Each register is read and written through buffers. The non-volatile portion (or the counter portion of the RTC) is updated only if RWEL is set and only after a valid write operation and stop bit. A sequential read or page write operation provides access to the contents of only one section of the CCR per operation. Access to another section requires a new operation. Continued
FN8099.2 May 8, 2006
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X1227
reads or writes, once reaching the end of a section, will wrap around to the start of the section. A read or write can begin at any address in the CCR. It is not necessary to set the RWEL bit prior to writing the status register. Section 5 supports a single byte read or write only. Continued reads or writes from this section terminates the operation. The state of the CCR can be read by performing a random read at any address in the CCR at any time. This returns the contents of that register location. Additional registers are read by performing a sequential read. The read instruction latches all Clock registers into a buffer, so an update of the clock does not change the time being read. A sequential read of the CCR will not result in the output of data from the memory array. At the end of a read, the master supplies a stop condition to end the operation and free the bus. After a read of Table 1. Clock/Control Memory Map
Addr. Type Reg Name 7 6 5 4 3 2 1 0 (optional) Range Default Bit
the CCR, the address remains at the previous address +1 so the user can execute a current address read of the CCR and continue reading the next Register. ALARM REGISTERS There are two alarm registers whose contents mimic the contents of the RTC register, but add enable bits and exclude the 24 hour time selection bit. The enable bits specify which registers to use in the comparison between the Alarm and Real Time Registers. For example: - Setting the Enable Month bit (EMOn*) bit in combination with other enable bits and a specific alarm time, the user can establish an alarm that triggers at the same time once a year. - *n = 0 for Alarm 0: N = 1 for Alarm 1
003F 0037 0036 0035 0034 0033 0032 0031 0030 0013 0012 0011 0010 000F 000E 000D 000C 000B 000A 0009 0008 0007 0006 0005 0004 0003 0002 0001 0000
Status RTC (SRAM)
Control (EEPROM)
Alarm1 (EEPROM)
Alarm0 (EEPROM)
SR Y2K DW YR MO DT HR MN SC DTR ATR INT BL Y2K1 DWA1 YRA1 MOA1 DTA1 HRA1 MNA1 SCA1 Y2K0 DWA0 YRA0 MOA0 DTA0 HRA0 MNA0 SCA0
BAT 0 0 Y23 0 0 MIL 0 0 0 0 BP2 0 EDW1 EMO1 EDT1 EHR1 EMN1 ESC1 0 EDW0 EMO0 EDT0 EHR0 EMN0 ESC0
0 RWEL WEL Y2K13 0 0 0 DY2 DY1 Y13 Y12 Y11 G13 G12 G11 D13 D12 D11 H13 H12 H11 M13 M12 M11 S13 S12 S11 0 DTR2 DTR1 ATR3 ATR2 ATR1 Unused BP1 BP0 WD1 WD0 0 0 0 A1Y2K21 A1Y2K20 A1Y2K13 0 0 0 0 0 0 DY2 DY1 Unused - Default = RTC Year value (No EEPROM) - Future expansion 0 0 A1G20 A1G13 A1G12 A1G11 0 A1D21 A1D20 A1D13 A1D12 A1D11 0 A1H21 A1H20 A1H13 A1H12 A1H11 A1M22 A1M21 A1M20 A1M13 A1M12 A1M11 A1S22 A1S21 A1S20 A1S13 A1S12 A1S11 0 A0Y2K21 A0Y2K20 A0Y2K13 0 0 0 0 0 0 DY2 DY1 Unused - Default = RTC Year value (No EEPROM) - Future expansion 0 0 A0G20 A0G13 A0G12 A0G11 0 A0D21 A0D20 A0D13 A0D12 A0D11 0 A0H21 A0H20 A0H13 A0H12 A0H11 A0M22 A0M21 A0M20 A0M13 A0M12 A0M11 A0S22 A0S21 A0S20 A0S13 A0S12 A0S11
AL1 0 0 Y22 0 0 0 M22 S22 0 0
AL0 Y2K21 0 Y21 0 D21 H21 M21 S21 0 ATR5
0 Y2K20 0 Y20 G20 D20 H20 M20 S20 0 ATR4
RTCF Y2K10 DY0 Y10 G10 D10 H10 M10 S10 DTR0 ATR0 0 A1Y2K10 DY0 A1G10 A1D10 A1H10 A1M10 A1S10 A0Y2K10 DY0 A0G10 A0D10 A0H10 A0M10 A0S10
19/20 0-6 0-99 1-12 1-31 0-23 0-59 0-59
01h 20h 00h 00h 00h 00h 00h 00h 00h 00h 00h 18h 20h 00h 00h 00h 00h 00h 00h 20h 00h 00h 00h 00h 00h 00h
19/20 0-6 1-12 1-31 0-23 0-59 0-59 19/20 0-6 1-12 1-31 0-23 0-59 0-59
11
FN8099.2 May 8, 2006
X1227
When there is a match, an alarm flag is set. The occurrence of an alarm can be determined by polling the AL0 and AL1 bits or by enabling the IRQ output, using it as hardware flag. The alarm enable bits are located in the MSB of the particular register. When all enable bits are set to `0', there are no alarms. - The user can set the X1227 to alarm every Wednesday at 8:00 AM by setting the EDWn*, the EHRn* and EMNn* enable bits to `1' and setting the DWAn*, HRAn* and MNAn* Alarm registers to 8:00 AM Wednesday. - A daily alarm for 9:30PM results when the EHRn* and EMNn* enable bits are set to `1' and the HRAn* and MNAn* registers are set to 9:30 PM. *n = 0 for Alarm 0: N = 1 for Alarm 1 REAL TIME CLOCK REGISTERS Clock/Calendar Registers (SC, MN, HR, DT, MO, YR) These registers depict BCD representations of the time. As such, SC (Seconds) and MN (Minutes) range from 00 to 59, HR (Hour) is 1 to 12 with an AM or PM indicator (H21 bit) or 0 to 23 (with MIL = 1), DT (Date) is 1 to 31, MO (Month) is 1 to 12, YR (Year) is 0 to 99. Date of the Week Register (DW) This register provides a Day of the Week status and uses three bits DY2 to DY0 to represent the seven days of the week. The counter advances in the cycle 0-1-2-3-4-5-6-0-1-2-... The assignment of a numerical value to a specific day of the week is arbitrary and may be decided by the system software designer. The default value is defined as `0'. 24 Hour Time If the MIL bit of the HR register is 1, the RTC uses a 24-hour format. If the MIL bit is 0, the RTC uses a 12hour format and H21 bit functions as an AM/PM indicator with a `1' representing PM. The clock defaults to standard time with H21 = 0. Leap Years Leap years add the day February 29 and are defined as those years that are divisible by 4. Years divisible by 100 are not leap years, unless they are also divisible by 400. This means that the year 2000 is a leap year, the year 2100 is not. The X1227 does not correct for the leap year in the year 2100. STATUS REGISTER (SR) The Status Register is located in the CCR Memory Map at address 003Fh. This is a volatile register only and is used to control the WEL and RWEL write
12
enable latches, read two power status and two alarm bits. This register is separate from both the array and the Clock/Control Registers (CCR). Table 2. Status Register (SR)
Addr 003Fh Default 7 BAT 0 6 AL1 0 5 AL0 0 4 0 0 3 0 0 2 RWEL 0 1 WEL 0 0 RTCF 1
BAT: Battery Supply--Volatile This bit set to "1" indicates that the device is operating from VBACK, not VCC. It is a read-only bit and is set/reset by hardware (X1227 internally). Once the device begins operating from VCC, the device sets this bit to "0". AL1, AL0: Alarm bits--Volatile These bits announce if either alarm 0 or alarm 1 match the real time clock. If there is a match, the respective bit is set to `1'. The falling edge of the last data bit in a SR Read operation resets the flags. Note: Only the AL bits that are set when an SR read starts will be reset. An alarm bit that is set by an alarm occurring during an SR read operation will remain set after the read operation is complete. RWEL: Register Write Enable Latch--Volatile This bit is a volatile latch that powers up in the LOW (disabled) state. The RWEL bit must be set to "1" prior to any writes to the Clock/Control Registers. Writes to RWEL bit do not cause a nonvolatile write cycle, so the device is ready for the next operation immediately after the stop condition. A write to the CCR requires both the RWEL and WEL bits to be set in a specific sequence. WEL: Write Enable Latch--Volatile The WEL bit controls the access to the CCR and memory array during a write operation. This bit is a volatile latch that powers up in the LOW (disabled) state. While the WEL bit is LOW, writes to the CCR or any array address will be ignored (no acknowledge will be issued after the Data Byte). The WEL bit is set by writing a "1" to the WEL bit and zeroes to the other bits of the Status Register. Once set, WEL remains set until either reset to 0 (by writing a "0" to the WEL bit and zeroes to the other bits of the Status Register) or until the part powers up again. Writes to WEL bit do not cause a nonvolatile write cycle, so the device is ready for the next operation immediately after the stop condition. RTCF: Real Time Clock Fail Bit--Volatile This bit is set to a "1" after a total power failure. This is a read only bit that is set by hardware (X1227 internally) when the device powers up after having lost all power to the device (both VCC and VBACK go to 0V).
FN8099.2 May 8, 2006
X1227
The bit is set regardless of whether VCC or VBACK is applied first. The loss of only one of the supplies does not set the RTCF bit to "1". On power-up after a total power failure, all registers are set to their default states and the clock will not increment until at least one byte is written to the clock register. The first valid write to the RTC section after a complete power failure resets the RTCF bit to "0" (writing one byte is sufficient). Unused Bits: This device does not use bits 3 or 4 in the SR, but must have a zero in these bit positions. The Data Byte output during a SR read will contain zeros in these bit locations. CONTROL REGISTERS The Control Bits and Registers, described under this section, are nonvolatile. Block Protect Bits--BP2, BP1, BP0 The Block Protect Bits, BP2, BP1 and BP0, determine which blocks of the array are write protected. A write to a protected block of memory is ignored. The block protect bits will prevent write operations to one of eight segments of the array. The partitions are described in Table 3 . Table 3. Block Protect Bits Protected Addresses X1227 None (Default) 180h - 1FFh
100h - 1FFh 000h - 1FFh 000h - 03Fh 000h - 07Fh 000h - 0FFh 000h - 1FFh
Watchdog Timer Control Bits--WD1, WD0 The bits WD1 and WD0 control the period of the Watchdog Timer. See Table 4 for options. Table 4. Watchdog Timer Time-Out Options WD1 WD0
0 0 1 1 0 1 0 1
Watchdog Time-Out Period
1.75 seconds 750 milliseconds 250 milliseconds Disabled (default)
ON-CHIP OSCILLATOR COMPENSATION Digital Trimming Register (DTR) -- DTR2, DTR1 and DTR0 (Non-Volatile) The digital trimming Bits DTR2, DTR1 and DTR0 adjust the number of counts per second and average the ppm error to achieve better accuracy. DTR2 is a sign bit. DTR2=0 means frequency compensation is > 0. DTR2=1 means frequency compensation is < 0. DTR1 and DTR0 are scale bits. DTR1 gives 10 ppm adjustment and DTR0 gives 20 ppm adjustment. A range from -30ppm to +30ppm can be represented by using three bits above.
BP2
BP1
BP0
0 0 0 0 1 1 1 1
0 0 1 1 0 0 1 1
0 1 0 1 0 1 0 1
Array Lock None
Upper 1/4 Upper 1/2 Full Array First Page First 2 pgs First 4 pgs First 8 pgs
Table 5. Digital Trimming Registers DTR Register DTR2
0 0 0 0 1 1 1 1
DTR1
0 1 0 1 0 1 0 1
DTR0
0 0 1 1 0 0 1 1
Estimated frequency PPM
0 (Default) +10 +20 +30 0 -10 -20 -30
13
FN8099.2 May 8, 2006
X1227
Analog Trimming Register (ATR) (Non-volatile) Six analog trimming Bits from ATR5 to ATR0 are provided to adjust the on-chip loading capacitance range. The on-chip load capacitance ranges from 3.25pF to 18.75pF. Each bit has a different weight for capacitance adjustment. Using a Citizen CFS-206 crystal with different ATR bit combinations provides an estimated ppm range from +116ppm to -37ppm to the nominal frequency compensation. The combination of digital and analog trimming can give up to +146ppm adjustment. The on-chip capacitance can be calculated as follows: CATR = [(ATR value, decimal) x 0.25pF] + 11.0pF Note that the ATR values are in two's complement, with ATR(000000) = 11.0pF, so the entire range runs from 3.25pF to 18.75pF in 0.25pF steps. The values calculated above are typical, and total load capacitance seen by the crystal will include approximately 2pF of package and board capacitance in addition to the ATR value. See Application section and Intersil's Application Note AN154 for more information. WRITING TO THE CLOCK/CONTROL REGISTERS Changing any of the nonvolatile bits of the clock/control register requires the following steps: - Write a 02h to the Status Register to set the Write Enable Latch (WEL). This is a volatile operation, so there is no delay after the write. (Operation preceeded by a start and ended with a stop). - Write a 06h to the Status Register to set both the Register Write Enable Latch (RWEL) and the WEL bit. This is also a volatile cycle. The zeros in the data byte are required. (Operation preceeded by a start and ended with a stop). - Write one to 8 bytes to the Clock/Control Registers with the desired clock, alarm, or control data. This sequence starts with a start bit, requires a slave byte of "11011110" and an address within the CCR and is terminated by a stop bit. A write to the CCR changes EEPROM values so these initiate a nonvolatile write cycle and will take up to 10ms to complete. Writes to undefined areas have no effect. The RWEL bit is reset by the completion of a nonvolatile write cycle, so the sequence must be repeated to again initiate another change to the CCR contents. If the sequence is not completed for any reason (by sending an incorrect number of bits or sending a start instead of a stop, for example) the RWEL bit is not reset and the device remains in an active mode. - Writing all zeros to the status register resets both the WEL and RWEL bits. - A read operation occurring between any of the previous operations will not interrupt the register write operation.
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FN8099.2 May 8, 2006
X1227
POWER-ON RESET Application of power to the X1227 activates a Poweron Reset Circuit that pulls the RESET pin active. This signal provides several benefits. - It prevents the system microprocessor from starting to operate with insufficient voltage. - It prevents the processor from operating prior to stabilization of the oscillator. - It allows time for an FPGA to download its configuration prior to initialization of the circuit. - It prevents communication to the EEPROM, greatly reducing the likelihood of data corruption on power-up. When VCC exceeds the device VTRIP threshold value for typically 250ms the circuit releases RESET, allowing the system to begin operation. Recommended slew rate is between 0.2V/ms and 50V/ms. WATCHDOG TIMER OPERATION The watchdog timer is selectable. By writing a value to WD1 and WD0, the watchdog timer can be set to 3 different time out periods or off. When the Watchdog timer is set to off, the watchdog circuit is configured for low power operation. Watchdog Timer Restart The Watchdog Timer is started by a falling edge of SDA when the SCL line is high and followed by a stop bit. The start signal restarts the watchdog timer counter, resetting the period of the counter back to the maximum. If another start fails to be detected prior to the watchdog timer expiration, then the RESET pin becomes active. In the event that the start signal occurs during a reset time out period, the start will have no effect. When using a single START to refresh watchdog timer, a STOP bit should be followed to reset the device back to stand-by mode. LOW VOLTAGE RESET OPERATION When a power failure occurs, and the voltage to the part drops below a fixed vTRIP voltage, a reset pulse is issued to the host microcontroller. The circuitry monitors the VCC line with a voltage comparator which senses a preset threshold voltage. Power-up and power-down waveforms are shown in Figure 5. The Low Voltage Reset circuit is to be designed so the RESET signal is valid down to 1.0V. When the low voltage reset signal is active, the operation of any in progress nonvolatile write cycle is unaffected, allowing a nonvolatile write to continue as long as possible (down to the power-on reset voltage). The low voltage reset signal, when active, terminates in progress communications to the device and prevents new commands, to reduce the likelihood of data corruption.
Figure 4. Watchdog Restart/Time Out
tRSP tRSPtWDO tRST tRSP>tWDO tRST
SCL SDA
RESET
Start
Stop Start Note: All inputs are ignored during the active reset period (tRST).
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FN8099.2 May 8, 2006
X1227
Figure 5. Power-on Reset and Low Voltage Reset
VTRIP VCC tPURST tRPD tR RESET tF VRVALID tPURST
VCC THRESHOLD RESET PROCEDURE [OPTIONAL] The X1227 is shipped with a standard VCC threshold (VTRIP) voltage. This value will not change over normal operating and storage conditions. However, in applications where the standard VTRIP is not exactly right, or if higher precision is needed in the VTRIP value, the X1227 threshold may be adjusted. The procedure is described below, and uses the application of a nonvolatile write control signal.
Setting the VTRIP Voltage It is necessary to reset the trip point before setting the new value. To set the new VTRIP voltage, apply the desired VTRIP threshold voltage to the VCC pin and tie the RESET pin to the programming voltage VP. Then write data 00h to address 01h. The stop bit following a valid write operation initiates the VTRIP programming sequence. Bring RESET to VCC to complete the operation. Note: this operation may take up to 10 milliseconds to complete and also writes 00h to address 01h of the EEPROM array.
Figure 6. Set VTRIP Level Sequence (VCC = desired VTRIP value)
RESET VCC SCL 01234567 VP = 15V 01234567 01234567 01234567
VCC
SDA AEh Note: BP0, BP1, BP2 must be disabled. 00h 01h 00h
Resetting the VTRIP Voltage This procedure is used to set the VTRIP to a "native" voltage level. For example, if the current VTRIP is 4.4V and the new VTRIP must be 4.0V, then the VTRIP must be reset. When VTRIP is reset, the new VTRIP is something less than 1.7V. This procedure must be used to set the voltage to a lower value. To reset the new VTRIP voltage, apply more than 3.0V to the VCC pin and tie the RESET pin to the programming voltage VP. Then write 00h to address 03h. The stop bit of a valid write operation initiates the VTRIP programming sequence. Bring RESET to VCC to complete the operation. Note: this operation takes up to 10 milliseconds to complete and also writes 00h to address 03h of the EEPROM array.
16
For best accuracy in setting VTRIP, it is advised that the following sequence be used. 1.Program VTRIP as above. 2.Measure resulting VTRIP by measuring the VCC value where a RESET occurs. Calculate Delta = (Desired - Measured) VTRIP value. 3.Perform a VTRIP program using the following formula to set the voltage of the RESET pin: VRESET = (Desired Value - Delta) + 0.025V
FN8099.2 May 8, 2006
X1227
Figure 7. Reset VTRIP Level Sequence
RESET VCC 01234567 SCL 01234567 01234567 01234567 VP = 15V VCC
SDA AEh Note: BP0, BP1, BP2 must be disabled. 00h 03h 00h
SERIAL COMMUNICATION Interface Conventions The device supports a bidirectional bus oriented protocol. The protocol defines any device that sends data onto the bus as a transmitter, and the receiving device as the receiver. The device controlling the transfer is called the master and the device being controlled is called the slave. The master always initiates data transfers, and provides the clock for both transmit and receive operations. Therefore, the devices in this family operate as slaves in all applications. Clock and Data Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are reserved for indicating start and stop conditions. See Figure 8. Start Condition All commands are preceded by the start condition, which is a HIGH to LOW transition of SDA when SCL is HIGH. The device continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition has been met. See Figure 9. Stop Condition All communications must be terminated by a stop condition, which is a LOW to HIGH transition of SDA when SCL is HIGH. The stop condition is also used to place the device into the Standby power mode after a read sequence. A stop condition can only be issued after the transmitting device has released the bus. See Figure 9.
Acknowledge Acknowledge is a software convention used to indicate successful data transfer. The transmitting device, either master or slave, will release the bus after transmitting eight bits. During the ninth clock cycle, the receiver will pull the SDA line LOW to acknowledge that it received the eight bits of data. Refer to Figure 10. The device will respond with an acknowledge after recognition of a start condition and if the correct Device Identifier and Select bits are contained in the Slave Address Byte. If a write operation is selected, the device will respond with an acknowledge after the receipt of each subsequent eight bit word. The device will acknowledge all incoming data and address bytes, except for: - The Slave Address Byte when the Device Identifier and/or Select bits are incorrect - All Data Bytes of a write when the WEL in the Write Protect Register is LOW - The 2nd Data Byte of a Status Register Write Operation (only 1 data byte is allowed) In the read mode, the device will transmit eight bits of data, release the SDA line, then monitor the line for an acknowledge. If an acknowledge is detected and no stop condition is generated by the master, the device will continue to transmit data. The device will terminate further data transmissions if an acknowledge is not detected. The master must then issue a stop condition to return the device to Standby mode and place the device into a known state.
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FN8099.2 May 8, 2006
X1227
Figure 8. Valid Data Changes on the SDA Bus
SCL
SDA Data Stable Data Change Data Stable
Figure 9. Valid Start and Stop Conditions
SCL SDA Start Stop
Figure 10. Acknowledge Response From Receiver
SCL from Master Data Output from Transmitter Data Output from Receiver Start Acknowledge 1 8 9
DEVICE ADDRESSING Following a start condition, the master must output a Slave Address Byte. The first four bits of the Slave Address Byte specify access to either the EEPROM array or to the CCR. Slave bits `1010' access the EEPROM array. Slave bits `1101' access the CCR. When shipped from the factory, EEPROM array is UNDEFINED, and should be programmed by the customer to a known state. Bit 3 through Bit 1 of the slave byte specify the device select bits. These are set to `111'. The last bit of the Slave Address Byte defines the operation to be performed. When this R/W bit is a one, then a read operation is selected. A zero selects a write operation. Refer to Figure 11. After loading the entire Slave Address Byte from the SDA bus, the X1227 compares the device identifier and device select bits with `1010111' or `1101111'. Upon a correct compare, the device outputs an acknowledge on the SDA line.
Following the Slave Byte is a two byte word address. The word address is either supplied by the master device or obtained from an internal counter. On powerup the internal address counter is set to address 0h, so a current address read of the EEPROM array starts at address 0. When required, as part of a random read, the master must supply the 2 Word Address Bytes as shown in Figure 11. In a random read operation, the slave byte in the "dummy write" portion must match the slave byte in the "read" section. That is if the random read is from the array the slave byte must be 1010111x in both instances. Similarly, for a random read of the Clock/Control Registers, the slave byte must be 1101111x in both places.
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FN8099.2 May 8, 2006
X1227
Figure 11. Slave Address, Word Address, and Data Bytes (64 Byte pages)
Device Identifier Slave Address Byte Byte 0 Word Address 1 0 0 0 0 0 0 0 A8 Byte 1
Array CCR
1 1
0 1
1 0
0 1
1
1
1
R/W
A7
A6
A5
A4
A3
A2
A1
A0
Word Address 0 Byte 2
D7
D6
D5
D4
D3
D2
D1
D0
Data Byte Byte 3
Write Operations Byte Write For a write operation, the device requires the Slave Address Byte and the Word Address Bytes. This gives the master access to any one of the words in the array or CCR. (Note: Prior to writing to the CCR, the master must write a 02h, then 06h to the status register in two preceding operations to enable the write operation. See "Writing to the Clock/Control Registers." Upon receipt of each address byte, the X1227 responds with an acknowledge. After receiving both address bytes the X1227 awaits the eight bits of data. After receiving Figure 12. Byte Write Sequence
Signals from the Master S t a r t 1
the 8 data bits, the X1227 again responds with an acknowledge. The master then terminates the transfer by generating a stop condition. The X1227 then begins an internal write cycle of the data to the nonvolatile memory. During the internal write cycle, the device inputs are disabled, so the device will not respond to any requests from the master. The SDA output is at high impedance. See Figure 12. A write to a protected block of memory is ignored, but will still receive an acknowledge. At the end of the write command, the X1227 will not initiate an internal write cycle, and will continue to ACK commands.
Slave Address 1 110 A C K
Word Address 1 0000000 A C K
Word Address 0
Data
S t o p
SDA Bus Signals From The Slave
A C K
A C K
Figure 13. Writing 30 bytes to a 64-byte memory page starting at address 40.
7 Bytes
23 Bytes
Address =6
Address Pointer Ends Here Addr = 7
Address 40
Address 63
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FN8099.2 May 8, 2006
X1227
Page Write The X1227 has a page write operation. It is initiated in the same manner as the byte write operation; but instead of terminating the write cycle after the first data byte is transferred, the master can transmit up to 63 more bytes to the memory array and up to 7 more bytes to the clock/control registers. (Note: Prior to writing to the CCR, the master must write a 02h, then 06h to the status register in two preceding operations to enable the write operation. See "Writing to the Clock/Control Registers." After the receipt of each byte, the X1227 responds with an acknowledge, and the address is internally incremented by one. When the counter reaches the end of the page, it "rolls over" and goes back to the first address on the same page. This means that the master can write 64 bytes to a memory array page or 8 bytes to a CCR section starting at any location on that page. For example, if the master begins writing at location 40 of the memory and loads 30 bytes, then the first 23 bytes are written to addresses 45 through 63, and the last 7 Figure 14. Page Write Sequence
S t a r t 1 n 64 for EEPROM array 1 n 8 for CCR Slave Address Word Address 1 Word Address 0 Data (1) Data (n) S t o p
bytes are written to columns 0 through 6. Afterwards, the address counter would point to location 7 on the page that was just written. If the master supplies more than the maximum bytes in a page, then the previously loaded data is over written by the new data, one byte at a time. Refer to Figure 13. The master terminates the Data Byte loading by issuing a stop condition, which causes the X1227 to begin the nonvolatile write cycle. As with the byte write operation, all inputs are disabled until completion of the internal write cycle. Refer to Figure 14 for the address, acknowledge, and data transfer sequence. Stops and Write Modes Stop conditions that terminate write operations must be sent by the master after sending at least 1 full data byte and it's associated ACK signal. If a stop is issued in the middle of a data byte, or before 1 full data byte + ACK is sent, then the X1227 resets itself without performing the write. The contents of the array are not affected.
Signals from the Master
SDA Bus
1
11 10 A C K
0000000 A C K A C K A C K
Signals from the Slave
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FN8099.2 May 8, 2006
X1227
Acknowledge Polling Disabling of the inputs during nonvolatile write cycles can be used to take advantage of the typical 5mS write cycle time. Once the stop condition is issued to indicate the end of the master's byte load operation, the X1227 initiates the internal nonvolatile write cycle. Acknowledge polling can begin immediately. To do this, the master issues a start condition followed by the Memory Array Slave Address Byte for a write or read operation (AEh or AFh). If the X1227 is still busy with the nonvolatile write cycle then no ACK will be returned. When the X1227 has completed the write operation, an ACK is returned and the host can proceed with the read or write operation. Refer to the flow chart in Figure 16. Note: Do not use the CCR slave byte (DEh or DFh) for acknowledge polling. Read Operations There are three basic read operations: Current Address Read, Random Read, and Sequential Read. Current Address Read Internally the X1227 contains an address counter that maintains the address of the last word read incremented by one. Therefore, if the last read was to address n, the next read operation would access data from address n+1. On power-up, the sixteen bit address is initialized to 0h. In this way, a current address read immediately after the power-on reset can download the entire contents of memory starting at the first location.Upon receipt of the Slave Address Byte with the R/W bit set to one, the X1227 issues an acknowledge, then transmits eight data bits. The master terminates the read operation by not responding with an acknowledge during the ninth clock and issuing a stop condition. Refer to Figure 15 for the address, acknowledge, and data transfer sequence. Figure 15. Current Address Read Sequence
Signals from the Master SDA Bus Signals from the Slave S t a r t 1 Slave Address S t o p
Figure 16. Acknowledge Polling Sequence
Byte load completed by issuing STOP. Enter ACK Polling
Issue START
Issue Memory Array Slave Address Byte AFh (Read) or AEh (Write) ACK returned? YES nonvolatile write Cycle complete. Continue command sequence? YES Continue normal Read or Write command sequence NO NO
Issue STOP
Issue STOP
PROCEED
It should be noted that the ninth clock cycle of the read operation is not a "don't care." To terminate a read operation, the master must either issue a stop condition during the ninth cycle or hold SDA HIGH during the ninth clock cycle and then issue a stop condition.
1 1 11 A C K Data
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FN8099.2 May 8, 2006
X1227
Random Read Random read operations allows the master to access any location in the X1227. Prior to issuing the Slave Address Byte with the R/W bit set to zero, the master must first perform a "dummy" write operation. The master issues the start condition and the slave address byte, receives an acknowledge, then issues the word address bytes. After acknowledging receipt of each word address byte, the master immediately issues another start condition and the slave address byte with the R/W bit set to one. This is followed by an acknowledge from the device and then by the eight bit data word. The master terminates the read operation by not responding with an acknowledge and then issuing a stop condition. Refer to Figure 17 for the address, acknowledge, and data transfer sequence. In a similar operation called "Set Current Address," the device sets the address if a stop is issued instead of the second start shown in Figure 17. The X1227 then goes into standby mode after the stop and all bus activity will be ignored until a start is detected. This operation loads the new address into the address counter. The next Current Address Read operation will read from the newly loaded address. This operation could be useful if the master knows the next address it needs to read, but is not ready for the data. Sequential Read Sequential reads can be initiated as either a current address read or random address read. The first data byte is transmitted as with the other modes; however, the master now responds with an acknowledge, indicating it requires additional data. The device continues to output data for each acknowledge received. The master terminates the read operation by not responding with an acknowledge and then issuing a stop condition. The data output is sequential, with the data from address n followed by the data from address n + 1. The address counter for read operations increments through all page and column addresses, allowing the entire memory contents to be serially read during one operation. At the end of the address space the counter "rolls over" to the start of the address space and the X1227 continues to output data for each acknowledge received. Refer to Figure 18 for the acknowledge and data transfer sequence.
Figure 17. Random Address Read Sequence
Signals from the Master S t a r t 1 Slave Address Word Address 1 Word Address 0 S t a r t 1 A C K A C K Slave Address 1 1 11 A C K Data S t o p
SDA Bus Signals from the Slave
1 110 A C K
000000 0
Figure 18. Sequential Read Sequence
Signals from the Master SDA Bus Signals from the Slave Slave Address A C K A C K A C K S t o p
1 A C K Data (1) Data (2) Data (n-1) Data (n)
(n is any integer greater than 1)
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FN8099.2 May 8, 2006
X1227
APPLICATION SECTION CRYSTAL OSCILLATOR AND TEMPERATURE COMPENSATION Intersil has now integrated the oscillator compensation circuity on-chip, to eliminate the need for external components and adjust for crystal drift over temperature and enable very high accuracy time keeping (<5ppm drift. The Intersil RTC family uses an oscillator circuit with on-chip crystal compensation network, including adjustable load-capacitance. The only external component required is the crystal. The compensation network is optimized for operation with certain crystal parameters which are common in many of the surface mount or tuning-fork crystals available today. Table 6 summarizes these parameters. Table 7 contains some crystal manufacturers and part numbers that meet the requirements for the Intersil RTC products. The turnover temperature in Table 6 describes the temperature where the apex of the of the drift vs. temperature curve occurs. This curve is parabolic with the drift increasing as (T-T0)2. For an Epson MC-405 device, for example, the turnover temperature is typically 25 deg C, and a peak drift of >110ppm occurs at Table 6. Crystal Parameters Required for Intersil RTC's Parameter
Frequency Freq. Tolerance Turnover Temperature Operating Temperature Range Parallel Load Capacitance Equivalent Series Resistance 20 -40 12.5 50 25
the temperature extremes of -40 and +85 deg C. It is possible to address this variable drift by adjusting the load capacitance of the crystal, which will result in predictable change to the crystal frequency. The Intersil RTC family allows this adjustment over temperature since the devices include on-chip load capacitor trimming. This control is handled by the Analog Trimming Register, or ATR, which has 6 bits of control. The load capacitance range covered by the ATR circuit is approximately 3.25pF to 18.75pF, in 0.25pf increments. Note that actual capacitance would also include about 2pF of package related capacitance. Incircuit tests with commercially available crystals demonstrate that this range of capacitance allows frequency control from +116ppm to -37ppm, using a 12.5pF load crystal. In addition to the analog compensation afforded by the adjustable load capacitance, a digital compensation feature is available for the Intersil RTC family. There are three bits known as the Digital Trimming Register or DTR, and they operate by adding or skipping pulses in the clock signal. The range provided is 30ppm in increments of 10ppm. The default setting is 0ppm. The DTR control can be used for coarse adjustments of frequency drift over temperature or for crystal initial accuracy correction.
Min
Typ
32.768
Max
100 30 85
Units
kHz ppm C C pF k
Notes
Down to 20ppm if desired Typically the value used for most crystals
For best oscillator performance
Table 7. Crystal Manufacturers Manufacturer
Citizen Epson Raltron SaRonix Ecliptek ECS Fox
Part Number
CM201, CM202, CM200S MC-405, MC-406 RSM-200S-A or B 32S12A or B ECPSM29T-32.768K ECX-306/ECX-306I FSM-327
Temp Range
-40 to +85C -40 to +85C -40 to +85C -40 to +85C -10 to +60C -10 to +60C -40 to +85C
+25C Freq Toler.
20ppm 20ppm 20ppm 20ppm 20ppm 20ppm 20ppm
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FN8099.2 May 8, 2006
X1227
A final application for the ATR control is in-circuit calibration for high accuracy applications, along with a temperature sensor chip. Once the RTC circuit is powered up with battery backup, the frequency drift is measured. The ATR control is then adjusted to a setting which minimizes drift. Once adjusted at a particular temperature, it is possible to adjust at other discrete temperatures for minimal overall drift, and store the resulting settings in the EEPROM. Extremely low overall temperature drift is possible with this method. The Intersil evaluation board contains the circuitry necessary to implement this control. For more detailed operation see Intersil's application note AN154 on Intersil's website at www.intersil.com. Layout Considerations The crystal input at X1 has a very high impedance and will pick up high frequency signals from other circuits on the board. Since the X2 pin is tied to the other side of the crystal, it is also a sensitive node. These signals can couple into the oscillator circuit and produce double clocking or mis-clocking, seriously affecting the accuracy of the RTC. Care needs to be taken in layout of the RTC circuit to avoid noise pickup. Below in Figure 19 is a suggested layout for the X1226 or X1227 devices. Figure 19. Suggested Layout for Intersil RTC in SO-8 For other RTC products, the same rules stated above should be observed, but adjusted slightly since the packages and pinouts are slightly different. Assembly Most electronic circuits do not have to deal with assembly issues, but with the RTC devices assembly includes insertion or soldering of a live battery into an unpowered circuit. If a socket is soldered to the board, and a battery is inserted in final assembly, then there are no issues with operation of the RTC. If the battery is soldered to the board directly, then the RTC device Vback pin will see some transient upset from either soldering tools or intermittent battery connections which can stop the circuit from oscillating. Once the battery is soldered to the board, the only way to assure the circuit will start up is to momentarily (very short period of time!) short the Vback pin to ground and the circuit will begin to oscillate. Oscillator Measurements When a proper crystal is selected and the layout guidelines above are observed, the oscillator should start up in most circuits in less than one second. Some circuits may take slightly longer, but startup should definitely occur in less than 5 seconds. When testing RTC circuits, the most common impulse is to apply a scope probe to the circuit at the X2 pin (oscillator output) and observe the waveform. DO NOT DO THIS! Although in some cases you may see a useable waveform, due to the parasitics (usually 10pF to ground) applied with the scope probe, there will be no useful information in that waveform other than the fact that the circuit is oscillating. The X2 output is sensitive to capacitive impedance so the voltage levels and the frequency will be affected by the parasitic elements in the scope probe. Applying a scope probe can possibly cause a faulty oscillator to start up, hiding other issues (although in the Intersil RTC's, the internal circuitry assures startup when using the proper crystal and layout). The best way to analyze the RTC circuit is to power it up and read the real time clock as time advances. Backup Battery Operation The X1 and X2 connections to the crystal are to be kept as short as possible. A thick ground trace around the crystal is advised to minimize noise intrusion, but ground near the X1 and X2 pins should be avoided as it will add to the load capacitance at those pins. Keep in mind these guidelines for other PCB layers in the vicinity of the RTC device. A small decoupling capacitor at the Vcc pin of the chip is mandatory, with a solid connection to ground. Many types of batteries can be used with the Intersil RTC products. 3.0V or 3.6V Lithium batteries are appropriate, and sizes are available that can power a Intersil RTC device for up to 10 years. Another option is to use a supercapacitor for applications where Vcc may disappear intermittently for short periods of time. Depending on the value of supercapacitor used, backup time can last from a few days to two weeks (with >1F). A simple silicon or Schottky barrier diode can be used in series with Vcc to charge the supercapacitor, which is connected to the Vback pin. Do not
FN8099.2 May 8, 2006
24
X1227
use the diode to charge a battery (especially lithium batteries!). Figure 20. Supercapacitor charging circuit be lower than the Vcc voltage during normal operation or the battery will be drained. A second consideration is the trip point setting for the system RESET- function, known as Vtrip. Vtrip is set at the factory at levels for systems with either Vcc = 5V or 3.3V operation, with the following standard options: VTRIP = 4.63V 3% VTRIP = 4.38V 3% VTRIP = 2.85V 3% VTRIP = 2.65V 3% The summary of conditions for backup battery operation is given in Table 8:
2.7-5.5V
VCC
Vback Supercapacitor VSS
Since the battery switchover occurs at Vcc=Vback0.1V (see Figure 20), the battery voltage must always Table 8. Battery Backup Operation
1. Example Application, Vcc = 5V, Vback = 3.0V
Condition
a. Normal Operation b. Vcc on with no battery c. Backup Mode
Vcc
5.00 5.00 0-1.8
Vback
3.00 0 1.8-3.0
Vtrip
4.38 4.38 4.38
Iback
<<1A 0 <2A
Reset
H H L
Notes
Timekeeping only
2. Example Application, Vcc=3.3V,Vback=3.0V
Condition
a. Normal Operation b. Vcc on with no battery c. Backup Mode d. UNWANTED - Vcc ON, Vback powering
Vcc
3.30 3.30 0-1.8 2.65 - 3.30
Vback
3.00 0 1.8-3.0* > Vcc
Vtrip
2.65 2.65 2.65 2.65
Iback
<<1A 0 <2A* up to 3mA
Reset
H H L H Timekeeping only Internal Vcc = Vback
*since Vback>2.65V is higher than Vtrip, the battery is powering the entire device
25
FN8099.2 May 8, 2006
X1227
Referring to Figure 20, Vtrip applies to the "Internal Vcc" node which powers the entire device. This means that if Vcc is powered down and the battery voltage at Vback is higher than the Vtrip voltage, then the entire chip will be running from the battery. If Vback falls to lower than Vtrip, then the chip shuts down and all outputs are disabled except for the oscillator and timekeeping circuitry. The fact that the chip can be powered from Vback is not necessarily an issue since standby current for the RTC devices is <2A for this mode (called "main timekeeping current" in the data sheet). Only when the serial interface is active is there an increase in supply current, and with Vcc powered down, the serial interface will most likely be inactive. One way to prevent operation in battery backup mode above the Vtrip level is to add a diode drop (silicon diode preferred) to the battery to insure it is below Vtrip. This will also provide reverse leakage protection which may be needed to get safety agency approval. One mode that should always be avoided is the operation of the RTC device with Vback greater than both Vcc and Vtrip (Condition 2d in Table 8). This will cause the battery to drain quickly as serial bus communication and non-volatile writes will require higher supplier current. PERFORMANCE DATA IBACK Performance
1.4 1.2 1.0 IBACK (A) 0.8 0.6 0.4 0.2 0 -40 25 60 Temperature C 85 IBACK vs. Temperature Multi-Lot Process Variation Data 3.3V 1.8V
26
FN8099.2 May 8, 2006
X1227 Small Outline Package Family (SO)
A D N (N/2)+1 h X 45
A E E1 PIN #1 I.D. MARK c SEE DETAIL "X"
1 B
(N/2) L1
0.010 M C A B e C H A2 GAUGE PLANE A1 0.004 C 0.010 M C A B b DETAIL X
SEATING PLANE L 4 4
0.010
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO) SYMBOL A A1 A2 b c D E E1 e L L1 h N NOTES: 1. Plastic or metal protrusions of 0.006" maximum per side are not included. 2. Plastic interlead protrusions of 0.010" maximum per side are not included. 3. Dimensions "D" and "E1" are measured at Datum Plane "H". 4. Dimensioning and tolerancing per ASME Y14.5M-1994 SO-8 0.068 0.006 0.057 0.017 0.009 0.193 0.236 0.154 0.050 0.025 0.041 0.013 8 SO-14 0.068 0.006 0.057 0.017 0.009 0.341 0.236 0.154 0.050 0.025 0.041 0.013 14 SO16 (0.150") 0.068 0.006 0.057 0.017 0.009 0.390 0.236 0.154 0.050 0.025 0.041 0.013 16 SO16 (0.300") (SOL-16) 0.104 0.007 0.092 0.017 0.011 0.406 0.406 0.295 0.050 0.030 0.056 0.020 16 SO20 (SOL-20) 0.104 0.007 0.092 0.017 0.011 0.504 0.406 0.295 0.050 0.030 0.056 0.020 20 SO24 (SOL-24) 0.104 0.007 0.092 0.017 0.011 0.606 0.406 0.295 0.050 0.030 0.056 0.020 24 SO28 (SOL-28) 0.104 0.007 0.092 0.017 0.011 0.704 0.406 0.295 0.050 0.030 0.056 0.020 28 TOLERANCE MAX 0.003 0.002 0.003 0.001 0.004 0.008 0.004 Basic 0.009 Basic Reference Reference NOTES 1, 3 2, 3 Rev. L 2/01
27
FN8099.2 May 8, 2006
X1227 Thin Shrink Small Outline Plastic Packages (TSSOP)
N INDEX AREA E E1 -B1 2 3 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 L 0.25(0.010) M GAUGE PLANE BM
M8.173
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D MIN 0.002 0.031 0.0075 0.0035 0.116 0.169 0.246 0.0177 8 0o 8o 0o MAX 0.047 0.006 0.051 0.0118 0.0079 0.120 0.177 0.256 0.0295 MILLIMETERS MIN 0.05 0.80 0.19 0.09 2.95 4.30 6.25 0.45 8 8o MAX 1.20 0.15 1.05 0.30 0.20 3.05 4.50 6.50 0.75 NOTES 9 3 4 6 7 Rev. 1 12/00
e
b 0.10(0.004) M C AM BS
A1 0.10(0.004)
A2 c
E1 e E L N
0.026 BSC
0.65 BSC
NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AC, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E1" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of "b" dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 28
FN8099.2 May 8, 2006

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